polishing material
英 [ˈpɒlɪʃɪŋ məˈtɪəriəl]
美 [ˈpɑːlɪʃɪŋ məˈtɪriəl]
网络 抛光材料
双语例句
- Experimental results show that the silicon wafer polishing with the new method on surface quality, and material remove rate are better than that of without polishing.
结果表明，该超声椭圆振动辅助抛光法对硅片抛光表面质量、材料去除率均有较显著的改善。 - Analysis on Hydrodynamics and Material Removal Rate of Circular Translational CMP; Research on Rotating Mechanism of Shaft-Disk Based on Polishing Material Machine
圆平动化学机械抛光的流体动力性能及材料去除率研究基于抛料机轴-圆盘转动机构的研究 - As the rapid development of application, the requirement on the polishing material have been increasing, so the new preparation technique for polishing material have been paid more and more attention.
随着高新技术的发展，对抛光材料的质量要求越来越高，因此，新型抛光材料的制备技术也越来越受到广泛的重视。 - Sapphire dome machining technology is introduced by exploring grinding tool and milling and polishing film and supplement material and machine speed and pressure etc.
分别从精磨模、精磨磨料、抛光膜层、抛光辅料、机床速度和压力等方面介绍了一种加工蓝宝石整流罩的工艺方法。 - The key solutions for the issues are large particle size control, new chemical for planarization and metal polishing control, and introducing controlled pores into SOG material.
这些材料的关键之处在于大颗粒尺寸的控制，进行平面化和金属抛光的化学控制以及将控制方法用于旋涂玻璃（）材料。 - The purpose of this paper is to determine the cutting parameters and the experiential formula of cutting force in cutting polyurethane polishing material.
本主旨在通过切削聚氨酯抛光材料时的切削力研究，选取这种材料切削加工时的各切削参数和确定切削力经验公式。 - Characteristics of the polishing area are investigated by fluid jet polishing ( FJP) and removal mechanism of material in the experiment.
从实验出发，研究了液体喷射抛光中抛光区的特征及材料的去除机理。 - A model based on appropriate simplification was developed for describing material removal rate with fixed abrasive pad during wafer polishing, and a numerical simulation of material removal rate was conducted.
在对研磨抛光过程作出适当简化的基础上，推导出了固结磨料研具研磨抛光工件的去除速率模型，并进行了数值模拟。 - An Ideal Match The results showed that nano-scale diamond is a excellent polishing material.
实验结果表明，纳米金刚石是一种理想的计算机磁头抛光材料。 - The effects of various components of the solution and technological parameters including polishing temperature, polishing time, the mode of agitation and the metal material property etc. are discussed.
讨论了抛光液各组分和抛光温度、时间、搅拌方式及材料性质对工艺参数的影响。 - EDM Supersonic Compound Polishing Technique of Super& Hard Material Tool
超硬材料工具电火花超声复合抛光技术的研究 - Research of cutting force in cutting polyurethane polishing material
聚氨酯抛光材料切削加工时的切削力研究 - Silicon dioxide nanoparticles have been widely used in chemical mechanical polishing ( CMP), coating material, rubber, binding agent, biology, iatrology, catalyst and other fields for their excellent properties.
纳米SiO2以其独特的性能已广泛地应用于化学机械抛光（ChemicalMechanicalPolishing，CMP）以及涂料、橡胶、粘合剂、生物、医学、催化剂等其他众多领域。 - The Shallow Low Temperature Polishing Method of Optical Material
光学材料的浅低温抛光方法 - The ceria-based polishing powder is a kind of most outstanding polishing material. With its unique polishing performance and quality, it is extensively applied to Hi-Tech fields, such as the optical glass, electronic product, etc.
铈基抛光粉是一种优秀的抛光材料，它以其独特的抛光性能及质量，广泛的应用于光学玻璃、电子产品等高科技领域。 - Preparation of Ultra-fine CeO_2 Precursor for Optical Glass Polishing Material
光学玻璃抛光材料用超细CeO2前驱体的制备 - In order to study the size and shape of "polishing spot" and the material removal rate of optical element, several MRF experiments have been done by using "standard" MPF.
研究了磁流变抛光中几种主要工艺参数对抛光区的大小和形状以及材料去除率的影响情况。 - Coated abrasive belt grinding, as an important branch of grinding technology, has many excellent performances, like high efficiency, little vibration and low temperature, and it is widely used in the grinding, lapping and polishing of many kinds of metal and nonmetal material.
砂带磨削是磨削加工技术的一个重要分支，它具有效率高、振动小和磨削温度低等优点，目前已广泛用于多种金属和非金属材料的磨削、研磨和抛光。 - The transferring and consuming of energy in polishing process between the grinding medium and material grain is evaluated.
对研磨过程中介质球和物料颗粒之间的能量传递进行了计算； - With the increasing of polishing time, the material removal amount increases rapidly within 60 min and then increases slowly.
随抛光时间延长，抛光初期材料去除量增加较快，但在后段时间内去除量增加趋势趋于平缓。 - The study also showed that when application of micro abrasive water jet polishing surface, the abrasive fluid, polishing time, and the workpiece material as well as the original surface roughness have a major impact on the polishing effect.
研究还表明，应用微磨料水射流进行工件表面抛光时，磨料液、抛光时间以及被抛光工件材料以及工件表面原始粗糙度等对抛光效果有重要影响。 - Through the repeated polishing experiments of hardess material precision balls, the effect indicated that the improved pressure loading system could raise the machining quality of the hardess material precision balls.
通过多次的硬质材料精密球的抛光实验，实验结果表明经过改进后的抛光压力加载系统能够提高加工球的质量。 - The law that some factors, such as the velocity of the fluid, the concentration and the size of particles, polishing time, affected the amount of material removed and the surface roughness was researched.
研究了流体的速度，磨粒的浓度以及粒径，抛光时间等对材料去除量和表面粗糙度的影响规律。 - The product is hopefully applied as cutting and polishing material in the fabrication of blue light LED.
这种产物有望应用于蓝光LED衬底的剪薄与抛光材料。 - Therefore, it is urgent to develop a new type of polishing plate material with the quality of high-temperature wear resistance and strong catalytic graphitization ability on diamond.
因此，亟待研究和开发一种兼备高温耐磨性和对金刚石石墨化催化能力的新型抛光盘材料。 - Therefore this design the speed is momentarily may move in the polishing process, according to the different material, the different shape carries on the corresponding speed regulation.
本设计在抛光过程中速度是随时可以调的，根据不同的材料，不同的形状进行相应的速度调节。 - Surface polishing treatment will reduce carbon material specific surface area, reduce carbon atoms and oxygen atom collision probability and improve the carbon material of oxidation resistance.
表面抛光处理会减少炭素材料比表面积，降低碳原子与氧原子撞击概率，提高了炭素材料的抗氧化性能。 - According to the analysis and research of the Areas designated by polishing for material removal rate, polishing unit time of the microscopic region is obtained.
通过对定点抛光区域的材料去除率的分析和研究，得出了单位时间抛光区域的微观形貌。 - With the increase of surface quality requirement of silicon substrate for integrated circuits, and the high price of rare earth raw materials, seeking new polishing material is becoming a hot spot of CMP.
随着集成电路对硅基芯片表面质量要求的不断提高以及稀土抛光粉价格不断攀升，寻求新的抛光材料就成为化学机械抛光技术发展的热点。